NIST: Physics Laboratory: Research Program

TECHNICAL ACTIVITIES 1998 - NISTIR 6268

ELECTRON AND OPTICAL PHYSICS DIVISION

MISSION
ORGANIZATION
CURRENT DIRECTIONS
TECHNICAL HIGHLIGHTS
FUTURE DIRECTIONS

TECHNICAL HIGHLIGHTS

  • X-Ray Microtomography of Integrated Circuits. Three-dimensional imaging of buried structures with sub-micron resolution represents an important tool for analyzing modern engineered structures such as those found in microelectronics, quantum wells, and multilayer magnetic devices. We have begun a program to perform x-ray microtomography of buried structures in integrated circuits, in collaboration with the Intel Corporation, Rensselaer Polytechnic Institute, and Argonne National Laboratory. We have used a 200 nm x-ray microprobe at 1.7 keV photon energy at Argonne's Advanced Photon Source to produce a series of two-dimensional microradiographs with different views of a pair of microelectronic interconnects. Tomographic algorithms were then applied to these microradiographs to synthesize a three-dimensional image of the buried circuit. With a capability of resolving features as small as 400 nm, this work represents the highest resolution tomography ever achieved at a photon energy above 1 keV (A. Kalukin, Z.H. Levine, and T.B. Lucatorto)
  X-ray images of an electromigration sample

Figure 1. X-ray images of an electromigration sample. This circuit was exposed to high current density, resulting in electromigration damage, which is seen as a break in the line pattern in the frame on the left. The left frame is one of the two-dimensional micrographs that have been tomographically analyzed to generate the three-dimensional image shown in the right frame. The spatial frame width is 10 microns, and the image resolution is 60 nm. The three-dimensional image incorporates data from twelve two-dimensional views, and has a voxel resolution of 180 nm.

  • Magnetic Exchange Coupling Strengths of Antiferromagnets. As part of a continuing program to understand the physical basis of magnetic coupling in magnetic multilayers, we measured the exchange coupling between Fe films separated by Ag, Au, Cr, Mn, V, Cu, or Al spacer layers. The films were grown epitaxially on nearly perfect Fe whisker substrates in order to achieve the atomic scale precision necessary to make meaningful comparisons with theory. The coupling through antiferromagnetic spacers, Cr and Mn, is especially of interest because of the current use of antiferromagnets to exchange bias spin valve structures. Figure 5 shows a measurement of the Fe/Cr/Fe exchange coupling strength. The sample for this measurement consists of a variable thickness Cr wedge deposited on the Fe whisker and topped with a thin Fe film. The figure consists of a series of magneto-optic Kerr images taken at different applied magnetic fields. The dark bands correspond to Cr thicknesses at which the Fe film is antiferromagnetically coupled to the whisker. When the applied magnetic field exceeds the exchange coupling strength, the Fe film magnetization becomes aligned with that of the whisker. The composite image therefore graphically shows the thickness dependence of the antiferromagnetic exchange coupling strength. Although Cr coupling strengths have been measured before, this is the first time that an Fe/Cr/Fe multilayer has been grown with sufficient precision to clearly see the spin density nature of the Cr in the coupling strength measurement. Cr is not an ideal ferromagnetic with a 2 layer periodicity, but an incommensurate spin density wave antiferromagnet with a 2.05 layer periodicity that leads to the modulated envelope of the coupling strength in Fig. 5 and the node at about 24 layers. This figure also shows how difficult measuring coupling strengths of well-ordered Fe/Cr/Fe structures one thickness at a time can be: a change in the Cr thickness of only a tenth of a monolayer can lead to over an order of magnitude change in the exchange coupling strength.
  Figure 5

Figure 5. A series of MOKE images from an Au(10 ML)/Fe(15 ML)/Cr wedge/Fe whisker sample taken at various applied magnetic fields, showing the field and Cr thickness dependence of the reversal of the antiferromagnetic regions (dark bands). The Fe/Cr/Fe exchange coupling strength is determined from the switching field. A SEMPA image of the same wedge at zero applied field is shown at the bottom for reference.

Mission  |  Organization  |  Current Directions  |  Technical Highlights  |  Future Directions

TECHNICAL ACTIVITIES 1998 - Contents


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Online: April 1999